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Job Details
Posted date: May 20, 2026
There have been 2 jobs posted with the title of Principal Circuit Design Engineer all time at Microsoft.Category: Silicon Engineering
Location: Raleigh, NC
Estimated salary: $223,500
Range: $142,800 - $304,200
Employment type: Full-Time
Work location type: 3 days / week in-office
Role: Individual Contributor
Description
OverviewMicrosoft Silicon, Cloud Hardware, and Infrastructure Engineering (SCHIE) is the team behind Microsoft’s expanding Cloud Infrastructure and responsible for powering Microsoft’s “Intelligent Cloud” mission. SCHIE delivers the core infrastructure and foundational technologies for Microsoft's over 200 online businesses including Bing, MSN, Office 365, Xbox Live, Teams, OneDrive, and the Microsoft Azure platform globally with our server and data center infrastructure, security and compliance, operations, globalization, and manageability solutions. Our focus is on smart growth, high efficiency, and delivering a trusted experience to customers and partners worldwide and we are looking for a Principal Circuit Design Engineer to help achieve that mission.
As Microsoft's cloud business continues to grow, the ability to deploy offerings and hardware infrastructure on time with high quality and low cost is of paramount importance. To achieve this goal, the Custom IP team works with architects, technologists, and design engineers to define and deliver differentiating custom IPs which bring high power, performance, and area advantages to the Azure Cloud. We are looking for a Principal Circuit Design Engineer with a passion for envisioning and creating complex technical IPs and solutions in conjunction with our SoC partners.
Responsibilities
Collaborate with SoC designers to develop Memory SRAM and Register file solutions to difficult PPA challenges.Work with internal and external process technology teams to understand and exploit advanced process DTCO knobs.Devise methodologies for statistical analysis and timing/power/EMIR characterization.Run quality assurance checks on IP collateral.Develop IP and post-silicon characterization plans for inclusion on advanced process technology testchips.Develop scripting automation for flows.
Qualifications
Required Qualifications:
Doctorate in Electrical Engineering, Computer Engineering, Computer Science, or related field AND 3+ years technical engineering experience OR Master's Degree in Electrical Engineering, Computer Engineering, Computer Science, or related field AND 6+ years technical engineering experience OR Bachelor's Degree in Electrical Engineering, Computer Engineering, Computer Science, or related field AND 8+ years technical engineering experience OR equivalent experience.
Other Requirements:
Ability to meet Microsoft, customer and/or government security screening requirements are required for this role. These requirements include but are not limited to the following specialized security screenings: Microsoft Cloud Background Check: This position will be required to pass the Microsoft Cloud Background Check upon hire/transfer and every two years thereafter. This role will require access to information that is controlled for export under export control regulations, potentially under the U.S. International Traffic in Arms Regulations or Export Administration Regulations, the EU Dual Use Regulation, and/or other export control regulations.  As a condition of employment, the successful candidate will be required to provide either proof of their country of citizenship or proof of their US. residency or other protected status (e.g., under 8 U.S.C. 1324b(a)(3)) for assessment of eligibility to access the export-controlled information. To meet this legal requirement, and as a condition of employment, the successful candidate’s citizenship will be verified with a valid passport. Lawful permanent residents, refugees, and asylees may verify status using other documents, where applicable.
Preferred Qualifications:
6+ years of experience in SRAM or Register file design.6+ years of experience in timing, power, EMIR characterization.Experience in SRAM and Register File design in advanced process technologies.Understanding of SRAM write and read assist techniques.Understanding of process technology and DTCO.Understanding of layout and provide guidance to layout design.Experience in yield and reliability.Experience in providing technical guidance to other engineers and multitasking across multiple SoC programs.Scripting experience in PERL, Python, or TCL.Working knowledge of and experience in utilizing AI for circuit design tasks.Ability to concisely communicate design value propositions and risks.Effective debug skills.
#SCHIE
Silicon Engineering IC5 - The typical base pay range for this role across the U.S. is USD $142,800 - $274,800 per year. There is a different range applicable to specific work locations, within the San Francisco Bay area and New York City metropolitan area, and the base pay range for this role in those locations is USD $188,000 - $304,200 per year.
Certain roles may be eligible for benefits and other compensation. Find additional benefits and pay information here:
https://careers.microsoft.com/us/en/us-corporate-pay
This position will be open for a minimum of 5 days, with applications accepted on an ongoing basis until the position is filled.
Microsoft is an equal opportunity employer. All qualified applicants will receive consideration for employment without regard to age, ancestry, citizenship, color, family or medical care leave, gender identity or expression, genetic information, immigration status, marital status, medical condition, national origin, physical or mental disability, political affiliation, protected veteran or military status, race, ethnicity, religion, sex (including pregnancy), sexual orientation, or any other characteristic protected by applicable local laws, regulations and ordinances. If you need assistance with religious accommodations and/or a reasonable accommodation due to a disability during the application process, read more about requesting accommodations.