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Job Details
Posted date: Oct 14, 2024
There have been 2 jobs posted with the title of Senior Thermal Engineer all time at Microsoft.Category: Hardware Engineering
Location: Redmond, WA
Estimated salary: $183,700
Range: $117,200 - $250,200
Employment type: Full-Time
Travel amount: 25.0%
Work location type: Up to 50% work from home
Role: Individual Contributor
Description
Azure’s Thermal Engineering team is looking for a Senior Thermal Engineer to focus on the thermal hardware design of Azure servers and related components at the server and rack level. A strong mix of technical breadth and depth is required to work cross-functionally with different disciplines (Mechanical, Electrical, Thermal, and Software) to develop thermal hardware to effectively manage high performance data center devices. You will work with internal and external partners, focusing on delivering the next generation of world class data center hardware.Relocation assistance is available to Redmond, WA within the Unisted States.
Key responsibilities:
Collaborate with internal and external partners across the globe to design hardware systems for the thermal management of Azure servers and related devices.Build, conduct thermal simulations, and review thermal simulation models from ODM partners to identify risks and improve thermal design solutions.Lead Thermal design reviews and presentations of concepts to peers, partner teams, and executives.Work jointly with multidisciplinary teams consisting of both in-house and external companies in the development of concept prototypes. Follow through with production development organizations to drive concepts onto the roadmap and into Azure’s fleet.Collaborate with multifunctional engineering groups to deliver hardware that meets the related product thermal specification.Collaborate with firmware and controls engineering teams to create robust Thermal control and monitoring systems.Conduct design/debug investigations and support failure analysis and resolution activities.Design and create thermal test plans. Collaborate with technicians and industry partners to complete tests. Analyze test data to validate product qualification.Embody our Culture and Values
Qualifications
Required/Minimum Qualifications7+ years of technical engineering experienceOR Bachelor's degree in Electrical Engineering, Computer Engineering, Mechanical Engineering, or related field AND 5+ years of technical engineering experienceOR Master's degree in Electrical Engineering, Computer Engineering, Mechanical Engineering, or related field AND 3+ years of technical engineering experienceOR Doctorate degree in Electrical Engineering, Computer Engineering, Mechanical Engineering, or related field.7+ years of industry experience related to thermal systems design and development.Understanding of thermal and mechanical design principles, fluid dynamics, pumps and compressors, mechanical vibration and shock, valve and manifold design, material compatibility, manufacturing processes, and validation7+ years of experience with Thermal/Fluids simulation using Ansys/Fluent/Icepak and/or Siemens/Mentor productsOther Requirements:
Ability to meet Microsoft, customer and/or government security screening requirements are required for this role. These requirements include but are not limited to the following specialized security screenings:
Microsoft Cloud Background Check: This position will be required to pass the Microsoft Cloud background check upon hire/transfer and every two years thereafter.Preferred Qualifications:
7+ years of experience in the electronics industry specifically related to high-powered liquid cooled servers electronics industry specifically related to high-powered liquid cooled servers electronics industry specifically related to high-powered liquid cooled servers electronics industry specifically related to high-powered liquid cooled servers electronics industry specifically related to high-powered liquid cooled servers2+ yrs experience with a thermal simulation tool ( e.g; Flotherm, Ansys, Icepak, etc.)Experience with prototyping, thermal design and development, and high-volume manufacturing of electronic enclosuresExperience partnering with and overseeing ODM engineersExperience in pump design, fluid loop sensors and controls, heat exchanger designFamiliar with CAD software tools PTC Creo, Windchill or similar software (ie Solidworks, Catia)Hardware Engineering IC4 - The typical base pay range for this role across the U.S. is USD $117,200 - $229,200 per year. There is a different range applicable to specific work locations, within the San Francisco Bay area and New York City metropolitan area, and the base pay range for this role in those locations is USD $153,600 - $250,200 per year.
Certain roles may be eligible for benefits and other compensation. Find additional benefits and pay information here: https://careers.microsoft.com/us/en/us-corporate-pay
Microsoft will accept applications for the role until October 28, 2024
Microsoft is an equal opportunity employer. All qualified applicants will receive consideration for employment without regard to age, ancestry, color, family or medical care leave, gender identity or expression, genetic information, marital status, medical condition, national origin, physical or mental disability, political affiliation, protected veteran status, race, religion, sex (including pregnancy), sexual orientation, or any other characteristic protected by applicable laws, regulations and ordinances. We also consider qualified applicants regardless of criminal histories, consistent with legal requirements. If you need assistance and/or a reasonable accommodation due to a disability during the application or the recruiting process, please send a request via the Accommodation request form.
Benefits/perks listed below may vary depending on the nature of your employment with Microsoft and the country where you work.
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