Senior Process Engineer at Microsoft

Senior Process Engineer Details

Jan. 25, 2019, 6:21 a.m.
Hardware Engineering
Individual Contributor
Full-Time
Redmond, WA
Microsoft HoloLens Team HoloLens Team is
Microsoft HoloLens Team is continuing to revolutionize consumer electronic devices and redefining the way people interact with technology. We are a growing product design team working in a startup environment on redefining experiences with epic technology innovation. We will continue to turn our ground-breaking AR hardware and software ideas into reality through shipping additional first-to-market products. We are currently seeking a Senior Hardware Engineer to drive development and prototyping of our optical devices. This position requires a high level of experience in developing assembly and packaging processes for micro-optical, micro-mechanical, and sensor systems. The Hardware Engineer will be working with internal and external teams on development and prototyping micro-optical and micro-mechanic devices for near eye display systems. This position requires the following: Direct experience with multiple advanced assembly or packaging processes (hermetic packaging, image sensor COB,

Work with designer to rapidly build and test prototype next generation devices. Define process and metrology requirements to guarantee device performance. Develop new metrology and process capabilities required to support next generation product development. Drive the specification, sourcing, and bring up of process and test equipment for prototyping activities. Communicate process capabilities and constraints in product design and development decision making. Transfer assembly processes to contract manufacturers to support transition to mass production. Apply statistical process control (SPC)
Required Direct experience with assembly and packaging of micro-optical devices, micro-mechanical assemblies, or silicon-based sensor. Experience directing or managing foreign manufactures or suppliers. Experience sourcing major capital equipment (assembly, test, semiconductor). Must be able to travel (up to 25%) to design and manufacturing locations throughout the world to include Asia and Europe. Preferred Demonstration of solid analytical and problem-solving skills, including problem identification, data analysis, action planning, and execution. Proven track record of driving development and
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